SMARTRAC Launches Trailblazing Technologies for Electronic Identity Documents

SMARTRAC N.V. announced the launch of its new SMART-SL and SMART-HERA ID card technologies. Both were be presented to industry professionals at the SMARTRAC booth (306) at Cartes America 2013.

Building on SMARTRAC’s long-standing wafer back-end processing, antenna manufacturing, antenna-chip interconnection and assembling experiences, the SMART-SL product family provides card manufacturers and security printers with thin, flat, and at the same time highly durable ID card inlays with a homogenously flat inlay surface.

The new ultra-thin SMART-SL products are manufactured utilizing the company’s proprietary and patented palladium bumping and wire-embedding technologies. The reduced inlay thickness of only 200µm is achieved by connecting the antenna with SMARTRAC’s unique chip die bonding technology to a copper chip-link carrier substituting commonly available chip module technology.

With the new SMART-SL products, card manufacturers are also able to benefit from:
• 10-year lifetime for RFID inlay and card functionality in the field.
• Prevention of micro cracks within the card, particularly when using polycarbonate.
• Easy integration of enhanced security features and additional security layers while meeting ISO card dimension specifications.
• Highest possible field strength of the RF antenna and ISO compliance for HF, UHF and NFC.
• Easy implementation of multi-component cards.

The SMART-HERA manufacturing concept consists of a specific dual interface card inlay and a dedicated machine for implanting the dual interface module into the card, resulting in the highest durability and reliability as well as the best performance available on the market.

The SMART-SL product family and the SMART-HERA manufacturing concept are both aimed at providing card manufacturers and security printers with pioneering and standard-setting new technologies to meet tomorrow’s requirements for high-security contactless identity documents.

“The new SMART-SL and SMART-HERA perfectly complement our product range and are fully in line with our aim to provide our business partners with top-quality and durable products for identity cards and e-passports,” said Martin Kuschewski, head of Business Unit eID and Member of the Group Executive Team. “We are very pleased to be the technology partner of choice for our global customers and to provide them with hands-on consultancy to get the best results for their respective ID project.”